cystech electronics corp. spec. no. : c156s6r issued date : 2013.08.23 revised date : 2013.09.04 page no. : 1/8 HBCA123JS6R cystek product specification pnp and npn dual digital transistors HBCA123JS6R features ?built-in bias resistors enable the co nfiguration of an inverter circu it without connecting external input resistors (see equi valent circuit). ?the bias resistors consist of thin-f ilm resistors with complete isolati on to allow positive biasing of the input for pnp transistor, and nega tive biasing of the input for npn transistor. they also have the advantage of almost completely eliminating parasitic effects. ? only the on/off conditions need to be set for operation, making device design easy. ? one dta123j chip and one dtc123j chip in a sot-363 package. ? mounting by sot-323 automatic mounting machines is possible. ?mounting cost and area can be cut in half. ? transistor elements are indepe ndent, eliminating interference. ?pb-free lead plating and halogen-free package. equivalent circuit outline sot-363r HBCA123JS6R r b 1=2.2k , r b 2=2.2k r be 1=47k , r be 2=47k tr1 tr2 r b 1 r be 2 r be 1 r b 2 ordering information device package shipping marking HBCA123JS6R sot-363 (pb-free lead plating an d halogen-free package) 3000 pcs / tape & reel 35
cystech electronics corp. spec. no. : c156s6r issued date : 2013.08.23 revised date : 2013.09.04 page no. : 2/8 HBCA123JS6R cystek product specification absolute maximum ratings (ta=25 ) limits parameter symbol tr1(npn) tr2(pnp) unit supply voltage v cc 50 -50 v input voltage v in -5~+12 -12~+5 v i o 100 -100 ma output current i o(max.) 100 -100 ma total power dissipation pd 150 (note) mw junction temperature tj 150 c storage temperature tstg -55~+150 c note : 120mw per element must not be exceeded. thermal performance parameter symbol limit unit thermal resistance, junction-to-ambient r ja 833 c/w thermal resistance, junction-to-case r jc 357 c/w characteristics (ta=25 ) ?tr1(npn) parameter symbol min. typ. max. unit test conditions v i(off) - - 0.5 v v cc =5v, i o =100 a input voltage v i(on) 1.1 - - v v o =0.3v, i o =5ma output voltage v o(on) - - 0.3 v i o /i i =5ma/0.25ma input current i i - - 3.6 ma v i =5v output current i o(off) - - 0.5 a v cc =50v, v i =0v dc current gain g i 80 - - - v o =5v, i o =10ma input resistance r 1 1.54 2.2 2.86 k - resistance ratio r 2 /r 1 17 21 26 - - transition frequency f t - 250 - mhz v ce =10v, i c =5ma, f=100mhz * * transition frequency of the device
cystech electronics corp. spec. no. : c156s6r issued date : 2013.08.23 revised date : 2013.09.04 page no. : 3/8 HBCA123JS6R cystek product specification ?tr2(pnp) parameter symbol min. typ. max. unit test conditions v i(off) - - -0.5 v v cc =-5v, i o =-100 a input voltage v i(on) -1.1 - - v v o =-0.3v, i o =-5ma output voltage v o(on) - - -0.3 v i o /i i =-5ma/-0.25ma input current i i - - -3.6 ma v i =-5v output current i o(off) - - -0.5 a v cc =-50v, v i =0v dc current gain g i 80 - - - v o =-5v, i o =-10ma input resistance r 1 1.54 2.2 2.86 k - resistance ratio r 2 /r 1 17 21 26 - - transition frequency f t - 250 - mhz v ce =-10v, i c =-5ma, f=100mhz * * transition frequency of the device recommended soldering footprint
cystech electronics corp. spec. no. : c156s6r issued date : 2013.08.23 revised date : 2013.09.04 page no. : 4/8 HBCA123JS6R cystek product specification typical characteristics ?tr1( npn) dc current gain vs output current 1 10 100 1000 0.1 1 10 100 output current ---io(ma) current gain--- hfe vo=5v output voltage vs output current 10 100 1000 0.1 1 10 100 output current ---io(ma) output voltage---vo(on)(mv) io/ii=20 input voltage vs output current (on characteristics) 0.1 1 10 0.1 1 10 100 output current --- io(ma) input voltage --- vi(on)(v) vo=0.3v output current vs input voltage (off characteristics) 0.01 0.1 1 10 0 0.5 1 1.5 input voltage --- vi(off)(v) output current --- io(ma) vcc=5v
cystech electronics corp. spec. no. : c156s6r issued date : 2013.08.23 revised date : 2013.09.04 page no. : 5/8 HBCA123JS6R cystek product specification ?tr2( pnp) dc current gain vs output current 1 10 100 1000 0.1 1 10 100 output current ---io(ma) current gain--- hfe vo=5v output voltage vs output current 10 100 1000 0.1 1 10 100 output current ---io(ma) output voltage---vo(on)(mv) io/ii=20 input voltage vs output current (on characteristics) 0.1 1 10 100 0.1 1 10 100 output current --- io(ma) input voltage --- vi(on)(v) vo=0.3v output current vs input voltage (off characteristics) 0.01 0.1 1 10 0 0.5 1 1.5 input voltage --- vi(off)(v) output current --- io(ma) vcc=5v power derating curves 0 20 40 60 80 100 120 140 160 0 50 100 150 200 ambient temperature --- ta( ) power dissipation---pd(mw) dual single
cystech electronics corp. spec. no. : c156s6r issued date : 2013.08.23 revised date : 2013.09.04 page no. : 6/8 HBCA123JS6R cystek product specification reel dimension carrier tape dimension
cystech electronics corp. spec. no. : c156s6r issued date : 2013.08.23 revised date : 2013.09.04 page no. : 7/8 HBCA123JS6R cystek product specification recommended wave soldering condition product peak temperature soldering time pb-free devices 260 +0/-5 c 5 +1/-1 seconds recommended temperature profile for ir reflow profile feature sn-pb eutectic assembly pb-free assembly average ramp-up rate (tsmax to tp) 3 c/second max. 3 c/second max. preheat ? temperature min(t s min) ? temperature max(t s max) ? time(ts min to ts max ) 100 c 150 c 60-120 seconds 150 c 200 c 60-180 seconds time maintained above: ? temperature (t l ) ? time (t l ) 183 c 60-150 seconds 217 c 60-150 seconds peak temperature(t p ) 240 +0/-5 c 260 +0/-5 c time within 5 c of actual peak temperature(tp) 10-30 seconds 20-40 seconds ramp down rate 6 c/second max. 6 c/second max. time 25 c to peak temperature 6 minutes max. 8 minutes max. note : all temperatures refer to topside of t he package, measured on the package body surface.
cystech electronics corp. spec. no. : c156s6r issued date : 2013.08.23 revised date : 2013.09.04 page no. : 8/8 HBCA123JS6R cystek product specification sot-363 dimension marking: date code: year + month year : 6 2006, 7 2007,?, etc month : 1 jan feb, ?, 9 sep, a oct, b nov, c dec millimeters inches millimeters inches dim min. max. min. max. dim min. max. min. max. a 0.900 1.100 0.035 0.043 e1 2.150 2.450 0.085 0.096 a1 0.000 0.100 0.000 0.004 e 0.650 typ 0.026 typ a2 0.900 1.000 0.035 0.039 e1 1.200 1.400 0.047 0.055 b 0.150 0.350 0.006 0.014 l 0.525 ref 0.021 ref c 0.080 0.150 0.003 0.006 l1 0.260 0.460 0.010 0.018 d 2.000 2.200 0.079 0.087 0 8 0 8 e 1.150 1.350 0.045 0.053 notes : 1 .controlling dimension : millimeters. 2.maximum lead thickness includes lead finish thickness, and minimum lead thickness is the minimum thickness of base material. 3.if there is any question with packing specification or packing method, please c ontact your local cystek sales office. material : ? lead : pure tin plated. ? mold compound : epoxy resin family, flammability solid burning class:ul94v-0. important notice: ? all rights are reserved. reproduction in whole or in part is prohibited without the prior written approval of cystek. ? cystek reserves the right to make changes to its products without notice. ? cystek semiconductor products are not warranted to be suitable for use in life-support applications, or systems. ? cystek assumes no liability for any consequence of customer pr oduct design, infringement of pat ents, or application assistance . 6-lead sot-363r plastic surface mounted package cystek package code: s6r style: pin 1. emitter1 (e1) pin 2. base1 (b1) pin 3. collector2 (c2) pin 4. emitter2 (e2) pin 5. base2 (b2) ctor1 (c1) pin 6. colle device code 35 2
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